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thermal: fix thermal_zone_bind_cooling_device prototype
When the prototype for thermal_zone_bind_cooling_device changed, the static inline wrapper function was left alone, which in theory can cause build warnings: I have seen this error in the past: drivers/thermal/db8500_thermal.c: In function 'db8500_cdev_bind': drivers/thermal/db8500_thermal.c:78:9: error: too many arguments to function 'thermal_zone_bind_cooling_device' ret = thermal_zone_bind_cooling_device(thermal, i, cdev, while this one no longer shows up, there is no doubt that the prototype is still wrong, so let's just fix it anyway. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Fixes: 6cd9e9f629f1 ("thermal: of: fix cooling device weights in device tree") Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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@ -438,7 +438,8 @@ static inline void thermal_zone_device_unregister(
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static inline int thermal_zone_bind_cooling_device(
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static inline int thermal_zone_bind_cooling_device(
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struct thermal_zone_device *tz, int trip,
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struct thermal_zone_device *tz, int trip,
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struct thermal_cooling_device *cdev,
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struct thermal_cooling_device *cdev,
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unsigned long upper, unsigned long lower)
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unsigned long upper, unsigned long lower,
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unsigned int weight)
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{ return -ENODEV; }
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{ return -ENODEV; }
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static inline int thermal_zone_unbind_cooling_device(
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static inline int thermal_zone_unbind_cooling_device(
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struct thermal_zone_device *tz, int trip,
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struct thermal_zone_device *tz, int trip,
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