Bob Moore 9e41d93c97 ACPICA: Fixed a memory leak when Device or Thermal objects referenced in packages ...

Problem introduced in fix for Package references.

Signed-off-by: Bob Moore <robert.moore@intel.com>
Signed-off-by: Alexey Starikovskiy <astarikovskiy@suse.de>
Signed-off-by: Len Brown <len.brown@intel.com>

2008-04-22 14:29:26 -04:00

..

dsfield.c

ACPICA: Update copyright to 2007.

2007-02-02 21:14:31 -05:00

dsinit.c

ACPICA: Update copyright to 2007.

2007-02-02 21:14:31 -05:00

dsmethod.c

ACPICA: Removed extraneous code

2008-04-22 14:29:22 -04:00

dsmthdat.c

ACPICA: Update copyright to 2007.

2007-02-02 21:14:31 -05:00

dsobject.c

ACPICA: Fixed a memory leak when Device or Thermal objects referenced in packages

2008-04-22 14:29:26 -04:00

dsopcode.c

ACPICA: Several fixes for internal method result stack

2008-04-22 14:29:20 -04:00

dsutils.c

ACPICA: changed order of interpretation of operand objects

2008-04-22 14:29:21 -04:00

dswexec.c

ACPICA: changed order of interpretation of operand objects

2008-04-22 14:29:21 -04:00

dswload.c

ACPICA: Update copyright to 2007.

2007-02-02 21:14:31 -05:00

dswscope.c

ACPICA: Update copyright to 2007.

2007-02-02 21:14:31 -05:00

dswstate.c

ACPICA: Several fixes for internal method result stack

2008-04-22 14:29:20 -04:00

Makefile

Linux-2.6.12-rc2

2005-04-16 15:20:36 -07:00