Eduardo Valentin a8892d8389 thermal: thermal_core: allow binding with limits on bind_params ...

When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).

This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>

2013-09-03 09:10:24 -04:00

..

cpu-cooling-api.txt

thermal: add generic cpufreq cooling implementation

2012-09-24 14:44:38 +08:00

exynos_thermal

Documentation: thermal: Explain the exynos thermal driver model

2013-08-13 09:52:04 -04:00

exynos_thermal_emulation

doc: fix misspellings with 'codespell' tool

2013-05-28 12:02:12 +02:00

intel_powerclamp.txt

PM: Introduce Intel PowerClamp Driver

2013-02-06 13:45:00 +08:00

nouveau_thermal

drm/nouveau/hwmon: s/fan0/fan1/

2013-02-20 16:00:25 +10:00

sysfs-api.txt

thermal: thermal_core: allow binding with limits on bind_params

2013-09-03 09:10:24 -04:00

x86_pkg_temperature_thermal

Thermal: Documentation for x86 package temperature thermal driver

2013-06-18 06:27:57 +08:00